cmpAPC
Features
cmpAPC combines a modern interface with a clear, workflow-oriented user experience. Engineers can move through complex CMP APC workflows quickly because the architecture is structured, modular, and consistent.
- General
cmpAPC offers APC functionality for engineers and production teams in the CMP area of semiconductor production.
The calculation of the polishing times is fully automated. The engineer can control and check every detail of the prediction. Extensive analysis possibilities give the user an overview of the process.
R2R solution for CMP
Calculate startup values for CMP tools to optimize the process. The extension is a 1-channel optimizer for the removal rate. Pad and head ages are available for monitoring and advanced control models.
Intuitive user interface
cmpAPC is available as a dedicated plug-in for the BlueLine UI framework and provides extensive tools for analyzing and configuring CMP processes.
cmpAPC offers APC functionality for engineers and production teams in the CMP area of semiconductor production.
The calculation of the polishing times is fully automated. The engineer can control and check every detail of the prediction. Extensive analysis possibilities give the user an overview of the process.
Master data and parameterization
APC behavior is fully configurable through master data. Master data can define actions or control information such as wafer layouts, target sets, and parameter models.
Each master data item can be parameterized. Parameters can be defined in lookup tables or retrieved from external data sources, giving engineers flexible control over process configuration with minimal effort.
cmpAPC offers APC functionality for engineers and production teams in the CMP area of semiconductor production.
The calculation of the polishing times is fully automated. The engineer can control and check every detail of the prediction. Extensive analysis possibilities give the user an overview of the process.
- Standard
Full inline integration
cmpAPC is fully integrated into the production line. On request from MES or automation, the module provides the optimized polish time for the next carrier. The system stores input data, measurement results, and tool counters as the basis for future predictions.
Detailed CMP controller setup
The CMP R2R controller can be configured in detail, including optimizer weighting, filter settings, constraints, and aging effects.
R2R levels allow fine-grained configuration for startup-value calculations.
Full data management included
Statistics
cmpAPC includes a powerful statistics engine for visualizing process data across multiple chart types.